一个很长的句子

\"areal engagement\" should be understood to mean that that part of the area of the working layer which is actually in contact with the semiconductor wafer on average during the grinding maching is significantly larger thant the contact area of the grinding coating of a cup grinding disk in the case of maching by means of a conventional cup grinding disk grinding process, for example DDG or SSG.

\"区域接合“应理解为意指在使用传统杯形砂轮的圆盘研磨工艺进行加工时，如DDG或SSG，工作层在研磨加工中实际上与半导体晶圆平均接触的部分区域（区域部分）要比杯形砂轮盘研磨涂层的接触面积大得多。

谢谢，学到了很多。