帮个忙句子太难了

grinding the rear surface of the wafer while retaining the outer surface of the wafer to which
the annular protective member is bonded on a chuck table of a grinding device, after the rear surface grinding step is carried out, a step of forming a film on the rear surface of the wafer to
the outer surface of which the annular protective member is bonded, and a step of conducting a probe test on the devices are carried out

to后面的句子不知道怎样和前面的句子连接到一起。

1。to which，定语从句，the wafer to which the annular protective member is bonded
2。to，从the rear surface of the wafer到the outer surface of the wafer的a film

嗯，虽然知道大概是这个样儿，但是本句子翻译起来实在是有点恶心

grinding the rear surface of the wafer while retaining the outer surface of the wafer to which
the annular protective member is bonded on a chuck table of a grinding device, after the rear surface grinding step is carried out, a step of forming a film on the rear surface of the wafer to
the outer surface of which the annular protective member is bonded, and a step of conducting a probe test on the devices are carried out

在抛光晶片后表面的同时，保持使环状保护部分将晶片的外表面与抛光装置夹盘工作台紧密接合。在后表面抛光完成后，执行一个步骤使环状保护部分与外表面紧密接触条件下在晶片后表面形成一层膜，接下来再执行一个步骤对加工完成后地设备进行一次探针测试。

devices 不太有把握译好。

嗯，thanks

专利中经常遇到这样的句子，真是头疼啊

skyrin 总是翻译得这么急匆匆的，呵呵，看看我的翻译，应该更好吧：

在一研磨装置的工作盘上对该晶片的后表面进行研磨处理，同时保持环状保护部件紧密贴合该晶片的外表面，当后表面研磨步骤完成后，实施在环状保护部件紧密贴合该晶片外表面的条件下对该晶片进行镀膜操作的步骤，以及实施对器件（应该是以该晶片为基础制成的半导体器件）进行探针检测的步骤。

grinding the rear surface of the wafer while retaining the outer surface of the wafer to which the annular protective member is bonded on a chuck table of a grinding device

应该翻为“在研磨晶片后表面的同时，保持连接有环状保护元件的晶片外表面位于研磨装置的卡盘台上”。我认为这里第一个to应该是和be bonded to一起的，retaining 应该是retain sth on sp.的句型。

brantyu的分析正确。原文句子结构分析如下：

grinding the rear surface of the wafer,
while retaining the outer surface of the wafer（to which the annular protective
member is bonded） on a chuck table of a grinding device.

说明：to which...... 修饰the outer surface of the wafer，
grinding和retaining由while并列。

After the rear surface grinding step is carried out,
a step of forming a film on the rear surface of the wafer( to the outer surface of which the annular protective member is bonded), and a step of conducting a probe test on the devices are carried out.

说明：即after the rear surface grinding step is carried out, a step of......and a step of...... are carried out.
to the outer surface of which......修饰wafer.

如果合适的话，把我用括号括出的内容也翻译在括号里，便于审查员同志们阅读理解。

grinding the rear surface of the wafer while retaining the outer surface of the wafer to which　the annular protective member is bonded on a chuck table of a grinding device, after the rear surface grinding step is carried out, a step of forming a film on the rear surface of the wafer to　the outer surface of which the annular protective member is bonded, and a step of conducting a probe test on the devices are carried out

在保持绑缚有环状保护元件的晶片外表面位于研磨设备的卡盘台上的同时,研磨晶片后表面。在后表面研磨步骤完成后，接下来在绑缚有环状保护元件的晶片后表面镀膜，以及对设备进行一次探针测试。