Metal tape for chip modules for smart card and chip module from the metal tape
Publication number: TW570246Y
Publication date: 2004-01-01
Inventor: CHANG TIEN-KUO (TW); LU WILLIAM (TW); WU JEMI (TW)
Applicant: IST INTERNAT SEMICONDUCTOR TEC (TW)
Classification:
- international: G06K19/00; G06K19/00; (IPC1-7): G06K19/00
- European:
Application number: TW20020209909U 20020627
Priority number(s): TW20020209909U 20020627
再问一下,上面这些信息是我在欧专局找到的,但是欧专局没有专利文件的全文,这个专利应该是台湾专利吧?可是我在台湾专利数据库里面怎么找不到这个专利呢? |