请帮忙翻译一下

USB memory package of claim 13, wherein one end is bonded; and the wire connecting the flash memory and wiring pattern looks as the first on the wiring pattern one end is formed into the reverse loop mode mode stitch-bonded in the conductive bump (stud bump) in which the other end is formed in the flash memory into the second in advance.

这句话实在不知道怎么断句，恳请牛人帮忙

其中一端被bonded，并且在所述wiring pattern一端上连接所述flash memory和视为the first 的wiring pattern的wire形成在conductive bump(stud bump) 中的stitch-bonded的reverse loop模式，其中……

我英文就三板斧，随便看看吧，不知道对不